Semiconductor surface mount services
Implementation technology that can accommodate various package products such as QFP, BGA, and CSP!
Our company, as a specialized manufacturer of semiconductor surface mount technology, provides high-quality and highly reliable products. We have established high-speed, high-density mounting lines to offer mounting technologies that align with market needs and timing. Products assembled in a safe and clean working environment, equipped with advanced facilities and thorough electrostatic prevention measures, are used in computers, electronic exchanges, audio equipment, and various other electronic devices. Please feel free to contact us if you have any inquiries. 【Overview】 ■ SMT Lines: 3 lines ■ Board Size: 50×50mm to 460mm×380mm ■ Chip Size: 0603 to CSP, BGA ■ Bond Dispenser: Inline 2 series ■ N2 Compatible *For more details, please download the PDF or feel free to contact us.
- Company：しぶかわ電子
- Price：Other
